Carrie
10-14-2003, 01:57 PM
Source:c|net (http://rss.com.com/2100-1006_3-5089995.html?tag=cd_lede)
By Stephen Shankland
Staff Writer, CNET News.com
update Sun Microsystems will announce Monday that its upcoming UltraSparc IV processor will outperform its predecessor by a factor of 1.6 to 2, providing more competition to Intel, IBM, Advanced Micro Devices and others.
At this week's Microprocessor Forum in San Jose, Calif., the company will announce that it expects to begin making UltraSparc IV later this year, and it will debut at a speed of 1.2GHz in products by June 2004, said Andy Ingram, vice president of Sun's processor marketing group.
UltraSparc IV packs two UltraSparc III processor cores onto a single slice of silicon. IBM used a similar technique to make its Power 4 processor, and Intel plans to follow suit with its Xeon and Itanium chips. Sun's chip will be able to plug into the same sockets as an UltraSparc III, meaning customers can upgrade their computers rather easily.
Read More Here (http://rss.com.com/2100-1006_3-5089995.html?tag=cd_lede)
By Stephen Shankland
Staff Writer, CNET News.com
update Sun Microsystems will announce Monday that its upcoming UltraSparc IV processor will outperform its predecessor by a factor of 1.6 to 2, providing more competition to Intel, IBM, Advanced Micro Devices and others.
At this week's Microprocessor Forum in San Jose, Calif., the company will announce that it expects to begin making UltraSparc IV later this year, and it will debut at a speed of 1.2GHz in products by June 2004, said Andy Ingram, vice president of Sun's processor marketing group.
UltraSparc IV packs two UltraSparc III processor cores onto a single slice of silicon. IBM used a similar technique to make its Power 4 processor, and Intel plans to follow suit with its Xeon and Itanium chips. Sun's chip will be able to plug into the same sockets as an UltraSparc III, meaning customers can upgrade their computers rather easily.
Read More Here (http://rss.com.com/2100-1006_3-5089995.html?tag=cd_lede)